Some problems in plane thermopiezoelectric materials with holes

Qing Hua Qin, Yiu Wing Mai, Shou Wen Yu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

33 Citations (Scopus)


Piezoelectric materials have recently attracted considerable attention due to their potential use in intelligent structural systems. In this paper, we treat the plane problem of thermopiezoelasticity with various holes and subject to coupled mechanical, electric and thermal loads. An analytical solution is obtained by applying the technique of conformal mapping and some identities in the Stroh formalism. The solution has a simple unified form for various holes such as ellipse, circle, triangle and square. By way of the solution, the expressions for the energy release rate and stress intensity factors of cracks are presented. Numerical results for concentration coefficients of stress and electric displacement along the hole boundary are given to assess the acceptability of the proposed method.

Original languageEnglish
Pages (from-to)427-439
Number of pages13
JournalInternational Journal of Solids and Structures
Issue number3
Publication statusPublished - 1 Jan 1999
Externally publishedYes

ASJC Scopus subject areas

  • Modelling and Simulation
  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics


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