Abstract
Many properties of brominated epoxy resin, a type of material widely used in printed circuit boards (PCBs), such as the coefficient of thermal expansion (CTE) (pre and post Tg), dielectric constant (Dk), dissipation factor (Df), tensile strength, and Young's modulus, have been evaluated according to size and content in terms of the weight of the aluminum nitride (AlN) filler. It has been found that the performance of epoxy resin improves significantly when AlN is used as the filler. Excellent properties were obtained when 2.3 mm AlN was added till 50 wt%; i.e., CTE (pre Tg)1/4 27 ppm/C, Tg1/4 128 C, Df1/4 0.016, Dk1/4 7.5, and Young's modulus1/4 7.5 GPa. The SEM results show that the dispersion of AlN nanopowder filler is largely homogeneous.
| Original language | English |
|---|---|
| Pages (from-to) | 567-581 |
| Number of pages | 15 |
| Journal | Journal of Composite Materials |
| Volume | 40 |
| Issue number | 7 |
| DOIs | |
| Publication status | Published - 1 Apr 2006 |
Keywords
- AlN
- Brominated epoxy resin
- Coefficient of thermal expansion (CTE)
- Dielectric constant (Dk)
- Dissipation factor (Df)
- Tensile strength
- Young's modulus
ASJC Scopus subject areas
- Ceramics and Composites
- Mechanics of Materials
- Mechanical Engineering
- Materials Chemistry