Size effect of AlN on the performance of Printed Circuit Board (PCB) material-brominated epoxy resin

Kam Chuen Yung, J. Wu, Tai Man Yue, C. S. Xie

Research output: Journal article publicationJournal articleAcademic researchpeer-review

13 Citations (Scopus)

Abstract

Many properties of brominated epoxy resin, a type of material widely used in printed circuit boards (PCBs), such as the coefficient of thermal expansion (CTE) (pre and post Tg), dielectric constant (Dk), dissipation factor (Df), tensile strength, and Young's modulus, have been evaluated according to size and content in terms of the weight of the aluminum nitride (AlN) filler. It has been found that the performance of epoxy resin improves significantly when AlN is used as the filler. Excellent properties were obtained when 2.3 mm AlN was added till 50 wt%; i.e., CTE (pre Tg)1/4 27 ppm/C, Tg1/4 128 C, Df1/4 0.016, Dk1/4 7.5, and Young's modulus1/4 7.5 GPa. The SEM results show that the dispersion of AlN nanopowder filler is largely homogeneous.
Original languageEnglish
Pages (from-to)567-581
Number of pages15
JournalJournal of Composite Materials
Volume40
Issue number7
DOIs
Publication statusPublished - 1 Apr 2006

Keywords

  • AlN
  • Brominated epoxy resin
  • Coefficient of thermal expansion (CTE)
  • Dielectric constant (Dk)
  • Dissipation factor (Df)
  • Tensile strength
  • Young's modulus

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Materials Chemistry

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