Keyphrases
Fracture Behavior
100%
Size Effect
100%
Mechanical Behavior
100%
Solder Joint
100%
Ag3Sn
100%
Constraint Effect
100%
Ductile Fracture
50%
Sandwich Structure
33%
Fracture Mode
33%
Brittle Fracture
33%
(R)-1
33%
Ni3S4
33%
Tensile Loading
16%
Tensile Strength
16%
High Tensile Strength
16%
Stiffness
16%
Finite Element Method
16%
Strengthening Effect
16%
Stress State
16%
Crack Initiation
16%
Strain Energy Release Rate
16%
Stress Damage
16%
Crack Propagation
16%
Electronics Assembly
16%
Soldering
16%
Dynamic Mechanical Analyzer
16%
Damage Equivalent Stress
16%
Electronic Devices
16%
Diameter-to-thickness Ratio
16%
Packaging System
16%
Tension Load
16%
Experimental Element
16%
Dispersion Strengthening
16%
Electronic Products
16%
Joint Changes
16%
Quasi-static Tension
16%
Weak Parts
16%
Fractographic Analysis
16%
Ductile-to-brittle
16%
System Assembly
16%
Crack Growth Driving Force
16%
Engineering
Microscale
100%
Fracture Behavior
100%
Joints (Structural Components)
100%
Constraint Effect
100%
Ductile Fracture
33%
Brittle Fracture
22%
Ultimate Tensile Strength
22%
Driving Force
11%
Experimental Result
11%
Stress State
11%
Tensiles
11%
Strengthening Effect
11%
Diameter Ratio
11%
Dynamic Mechanical Analyser
11%
Electronic Product
11%
Equivalent Stress
11%
Strain-Energy Release Rate
11%
Crack Growth
11%
Crack Propagation
11%
Crack Initiation
11%
Finite Element Analysis
11%
Energy dispersive spectrometry
11%
Material Science
Fracture Behavior
100%
Solder Joint
100%
Constraint Effect
100%
Ductile Fracture
50%
Brittle Fracture
33%
Ultimate Tensile Strength
33%
Scanning Electron Microscopy
16%
Crack Propagation
16%
Crack Initiation
16%
Crack Growth
16%
Energy-Dispersive X-Ray Spectroscopy
16%
Finite Element Methods
16%