TY - GEN
T1 - SISO RIS-Enabled Joint Indoor Near-Field Localization and Synchronization
AU - Yan, Han
AU - Chen, Hua
AU - Liu, Wei
AU - Wang, Gang
AU - Yi, Zelong
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024/8
Y1 - 2024/8
N2 - The problem of reconfigurable intelligent surface (RIS)-aided 3D localization and synchronization in multipath environments is studied for a single-input single-output (SISO) setup. To obtain coarse estimates of channel parameters, the well-known methods including canonical polyadic decomposition (CPD) and orthogonal matching pursuit (OMP) are combined to estimate the time of arrival (ToA) and angle of departure (AoD) parameters at the RIS. Subsequently, the distances are estimated using the l1-norm regularization method. In addition, the channel parameters are refined through a maximum likelihood estimation (MLE) formulation and the position and clock offset are recovered using a least-squares approach. Numerical results are provided to show the high accuracy of the proposed 3D localization method.
AB - The problem of reconfigurable intelligent surface (RIS)-aided 3D localization and synchronization in multipath environments is studied for a single-input single-output (SISO) setup. To obtain coarse estimates of channel parameters, the well-known methods including canonical polyadic decomposition (CPD) and orthogonal matching pursuit (OMP) are combined to estimate the time of arrival (ToA) and angle of departure (AoD) parameters at the RIS. Subsequently, the distances are estimated using the l1-norm regularization method. In addition, the channel parameters are refined through a maximum likelihood estimation (MLE) formulation and the position and clock offset are recovered using a least-squares approach. Numerical results are provided to show the high accuracy of the proposed 3D localization method.
KW - localization
KW - near-field
KW - Reconfigurable Intelligent Surface
KW - synchronization
UR - http://www.scopus.com/inward/record.url?scp=85206461752&partnerID=8YFLogxK
U2 - 10.1109/ICCC62479.2024.10682048
DO - 10.1109/ICCC62479.2024.10682048
M3 - Conference article published in proceeding or book
AN - SCOPUS:85206461752
T3 - 2024 IEEE/CIC International Conference on Communications in China, ICCC 2024
SP - 219
EP - 223
BT - 2024 IEEE/CIC International Conference on Communications in China, ICCC 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE/CIC International Conference on Communications in China, ICCC 2024
Y2 - 7 August 2024 through 9 August 2024
ER -