Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Yi Zhang; Huai Wang; Zhongxu Wang; Frede Blaabjerg

doi:10.1109/ECCE.2018.8558180

Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Yi Zhang
, Huai Wang
, Zhongxu Wang
, Frede Blaabjerg

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

2 Citations (Scopus)

Abstract

Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.

Original language	English
Title of host publication	2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	6830-6837
Number of pages	8
ISBN (Electronic)	9781479973118
DOIs	https://doi.org/10.1109/ECCE.2018.8558180
Publication status	Published - 3 Dec 2018
Event	10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018 - Portland, United States Duration: 23 Sept 2018 → 27 Sept 2018

Publication series

Name	2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018

Conference

Conference	10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018
Country/Territory	United States
City	Portland
Period	23/09/18 → 27/09/18

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

ASJC Scopus subject areas

Energy Engineering and Power Technology
Renewable Energy, Sustainability and the Environment
Control and Optimization
Computer Networks and Communications
Hardware and Architecture
Information Systems and Management

More information

10.1109/ECCE.2018.8558180

Cite this

Zhang, Y., Wang, H., Wang, Z., & Blaabjerg, F. (2018). Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters. In 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018 (pp. 6830-6837). Article 8558180 (2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECCE.2018.8558180

Zhang, Yi ; Wang, Huai ; Wang, Zhongxu et al. / Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters. 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 6830-6837 (2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018).

@inproceedings{19c5da86cd8746d399faf78e6e8c57b1,

title = "Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters",

abstract = "Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.",

author = "Yi Zhang and Huai Wang and Zhongxu Wang and Frede Blaabjerg",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018 ; Conference date: 23-09-2018 Through 27-09-2018",

year = "2018",

month = dec,

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doi = "10.1109/ECCE.2018.8558180",

language = "English",

series = "2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

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booktitle = "2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018",

}

Zhang, Y, Wang, H, Wang, Z & Blaabjerg, F 2018, Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters. in 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018., 8558180, 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018, Institute of Electrical and Electronics Engineers Inc., pp. 6830-6837, 10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018, Portland, United States, 23/09/18. https://doi.org/10.1109/ECCE.2018.8558180

Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters. / Zhang, Yi; Wang, Huai; Wang, Zhongxu et al.
2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 6830-6837 8558180 (2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018).

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

TY - GEN

T1 - Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

AU - Zhang, Yi

AU - Wang, Huai

AU - Wang, Zhongxu

AU - Blaabjerg, Frede

PY - 2018/12/3

Y1 - 2018/12/3

N2 - Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.

AB - Thermal modeling of modular multilevel converters (MMCs) are of interest for reliability-oriented component sizing. However, conventional analytical thermal modeling is difficult to consider an inherent thermal unbalance in MMCs, while a time-domain simulation is challenging to process one-year mission profiles in reliability evaluation. This paper proposes a thermal modeling method for IGBT modules in MMCs based on simplified equivalent power loss profiles. It compromises the accuracy and computation time. A derived analytical equation quantifies the modeling error and the level of simplification for periodic power loss profiles related to the ac output frequency of MMCs. The theoretical results have been verified by both simulations and experiments.

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U2 - 10.1109/ECCE.2018.8558180

DO - 10.1109/ECCE.2018.8558180

M3 - Conference article published in proceeding or book

AN - SCOPUS:85060274764

T3 - 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018

SP - 6830

EP - 6837

BT - 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 10th Annual IEEE Energy Conversion Congress and Exposition, ECCE 2018

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ER -

Zhang Y, Wang H, Wang Z, Blaabjerg F. Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters. In 2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 6830-6837. 8558180. (2018 IEEE Energy Conversion Congress and Exposition, ECCE 2018). doi: 10.1109/ECCE.2018.8558180

Simplified Estimation of the Junction Temperature Fluctuation at the Output Frequency for IGBT Modules in Modular Multilevel Converters

Abstract

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Conference

UN SDGs

ASJC Scopus subject areas

More information

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