Silicon-on-organic integration of a 2.4GHz VCO using high Q copper inductors and solder-bumped flip chip technology

X. Huo, Guo Wei Xiao, Kevin J. Chen, Philip Ching Ho Chan

Research output: Journal article publicationConference articleAcademic researchpeer-review

1 Citation (Scopus)

Abstract

High Q copper inductors were fabricated on low-cost and low-loss BT and glass substrate using electroplating process. A differential LC VCO circuit was designed using these high Q inductors at 2.4GHz. Flip chip and MCM technology were applied to assemble the active chips on BT and glass substrate. The inductors exhibited Q-factor as high as 30 at 2.4GHz. VCOs with copper inductors on BT and glass substrate had phase noise of -108 dBc/Hz at 600 kHz offset for a 2.4GHz carrier, which is 6dB improvement compared with the one with on-chip Al inductors.
Original languageEnglish
Pages (from-to)537-540
Number of pages4
JournalProceedings of the Custom Integrated Circuits Conference
Publication statusPublished - 19 Nov 2003
Externally publishedYes
EventProceedings of the IEEE 2003 Custom Integrated Circuits Conference - San Jose, CA, United States
Duration: 21 Sep 200324 Sep 2003

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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