Silicon-on-organic integration of a 2.4-GHz VCO using high-Q copper inductors and solder-bumped flip chip technology

Xiao Huo, Guo Wei Xiao, Philip Ching Ho Chan, Kevin J. Chen

Research output: Journal article publicationJournal articleAcademic researchpeer-review

2 Citations (Scopus)

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Keyphrases

Engineering

Material Science