Silicon-on-organic integration of a 2.4-GHz VCO using high-Q copper inductors and solder-bumped flip chip technology

Xiao Huo, Guo Wei Xiao, Philip Ching Ho Chan, Kevin J. Chen

Research output: Journal article publicationJournal articleAcademic researchpeer-review

2 Citations (Scopus)

Abstract

High-Q copper inductors were fabricated on low-cost and low-loss bismaleimide triazine (BT) and glass substrate using electroplating process. A differential LC voltage-controlled oscillator (VCO) circuit was designed using these high-Q inductors at 2.4 GHz. Flip chip and multichip module (MCM) technologies were applied to assemble the active chips on BT and glass substrate. The inductors exhibited Q-factor as high as 25 at 2.4 GHz. VCOs with copper inductors on BT and glass substrate had phase noise of -108 dBc/Hz at 600 kHz offset for a 2.4-GHz carrier, which is 6-dB improvement compared with the one with on-chip Al inductors. There was almost no substrate loss for inductors on BT and glass substrates. The effect of fabrication defects and solder joint resistance were also investigated. This technique can be extended to other building blocks, thus realizing integration of the whole RF system.
Original languageEnglish
Pages (from-to)191-196
Number of pages6
JournalIEEE Transactions on Components and Packaging Technologies
Volume32
Issue number1
DOIs
Publication statusPublished - 31 Mar 2009
Externally publishedYes

Keywords

  • Complementary metal-oxide-semiconductor (CMOS)
  • Copper
  • Flip chip devices
  • Inductors
  • Integrated circuit packaging
  • Voltage-controlled oscillators (VCOs)

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this