Sensors for ultrasonic wire bonding process control

Siu San Chiu, Helen Lai Wah Chan, Siu Wing Or, Yiu Ming Cheung, Chi Wah Yuen, Peter Chou Kee Liu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

2 Citations (Scopus)


Ultrasonic wire bonding is an important technique in microelectronics packaging, as it provides electrical connections between an integrated circuit (IC) and the chip carrier. As the bond quality can vary appreciably, it is important to develop some in-process monitoring method to improve the reliability and quality of bonding. In this work, a piezoelectric lead zirconate titanate (PZT) sensor was used to measure two critical parameters. They are: (1) the temporal profiles of ultrasonic power and (2) the impact force imparted to the bonding pad by the bonding tool. A calibrated wire strain gauge was also used to measure the impact dynamic force and the static force applied to the bond surface. This is compared to that of the PZT sensor.
Original languageEnglish
Pages (from-to)211-216
Number of pages6
Issue number1-4
Publication statusPublished - 1 Jan 1999


  • Piezoelectric sensors
  • Strain gauge
  • Ultrasonic transducer
  • Wire bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics


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