Sensors for automatic process control of wire bonding

Siu Wing Or, H. L W Chan, V. C. Lo, C. W. Yuen

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

11 Citations (Scopus)

Abstract

PZT sensors were installed on an ultrasonic transducer used for wire bonding in order to record ultrasonic amplitude and bonding time during the bonding process. To find an appropriate location for the sensor placement, the vibration displacement distributions of the transducer were measured using a high frequency heterodyne interferometer. The non-linear signal detected by the PZT sensor was processed and the signatures of the higher frequency harmonics were recorded and related to the bonding quality. The change in harmonic contents and its relation with bond quality will be used to develop a real-time automatic process control system for wire bonding.
Original languageEnglish
Title of host publicationIEEE International Symposium on Applications of Ferroelectrics
PublisherIEEE
Pages991-994
Number of pages4
Publication statusPublished - 1 Dec 1996
EventProceedings of the 1996 10th IEEE International Symposium on Applications of Ferroelectrics, ISAF. Part 1 (of 2) - East Brunswick, NJ, United States
Duration: 18 Aug 199621 Aug 1996

Conference

ConferenceProceedings of the 1996 10th IEEE International Symposium on Applications of Ferroelectrics, ISAF. Part 1 (of 2)
CountryUnited States
CityEast Brunswick, NJ
Period18/08/9621/08/96

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

Cite this