Abstract
A simple and accurate characterization method for the self-heating effect in SOI MOSFET is reported for the first time. The AC output conductance at one bias point and several frequencies are measured to determine the thermal resistance (Rth) and thermal capacitance (Cth) associated with SOI devices. The proposed methodology is critical for removing the misleadingly large self-heating effect from the DC IV data in device modeling.
Original language | English |
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Pages (from-to) | 175-178 |
Number of pages | 4 |
Journal | Technical Digest - International Electron Devices Meeting |
Publication status | Published - 1 Dec 1999 |
Externally published | Yes |
Event | 1999 IEEE International Devices Meeting (IEDM) - Washington, DC, United States Duration: 5 Dec 1999 → 8 Dec 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry