Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

Siu Wing Or; S.Y. Wong; H.C. Wong; Y.M. Cheung; P.K. Choy

Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

Siu Wing Or
, S.Y. Wong
, H.C. Wong
, Y.M. Cheung
, P.K. Choy

The Hong Kong Polytechnic University

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Pages	319-320
Number of pages	2
Publication status	Published - 2008
Event	Symposium on Ultrasonic Electronics - Duration: 1 Jan 2008 → …

Conference

Conference	Symposium on Ultrasonic Electronics
Period	1/01/08 → …

Cite this

@conference{d42548d3eb5f472d8c2f54f324a643ff,

title = "Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates",

author = "Or, \{Siu Wing\} and S.Y. Wong and H.C. Wong and Y.M. Cheung and P.K. Choy",

year = "2008",

language = "English",

pages = "319--320",

note = "Symposium on Ultrasonic Electronics ; Conference date: 01-01-2008",

}

Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates. / Or, Siu Wing; Wong, S.Y.; Wong, H.C. et al.
2008. 319-320 Paper presented at Symposium on Ultrasonic Electronics.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

TY - CONF

T1 - Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

AU - Or, Siu Wing

AU - Wong, S.Y.

AU - Wong, H.C.

AU - Cheung, Y.M.

AU - Choy, P.K.

PY - 2008

Y1 - 2008

M3 - Conference presentation (not published in journal/proceeding/book)

SP - 319

EP - 320

T2 - Symposium on Ultrasonic Electronics

Y2 - 1 January 2008

ER -