Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

Siu Wing Or, S.Y. Wong, H.C. Wong, Y.M. Cheung, P.K. Choy

Research output: Unpublished conference presentation (presented paper, abstract, poster)Conference presentation (not published in journal/proceeding/book)Academic researchpeer-review

Original languageEnglish
Number of pages2
Publication statusPublished - 2008
EventSymposium on Ultrasonic Electronics -
Duration: 1 Jan 2008 → …


ConferenceSymposium on Ultrasonic Electronics
Period1/01/08 → …

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