Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

Siu Wing Or; S.Y. Wong; H.C. Wong; Y.M. Cheung; P.K. Choy

Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

Siu Wing Or, S.Y. Wong, H.C. Wong, Y.M. Cheung, P.K. Choy

The Hong Kong Polytechnic University

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Pages	319-320
Number of pages	2
Publication status	Published - 2008
Event	Symposium on Ultrasonic Electronics - Duration: 1 Jan 2008 → …

Conference

Conference	Symposium on Ultrasonic Electronics
Period	1/01/08 → …

Cite this

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title = "Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates",

author = "Or, {Siu Wing} and S.Y. Wong and H.C. Wong and Y.M. Cheung and P.K. Choy",

year = "2008",

language = "English",

pages = "319--320",

note = "Symposium on Ultrasonic Electronics ; Conference date: 01-01-2008",

}

Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates. / Or, Siu Wing; Wong, S.Y.; Wong, H.C. et al.
2008. 319-320 Paper presented at Symposium on Ultrasonic Electronics.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

TY - CONF

T1 - Room-temperature ultrasonic bonding of semiconductor thin dies with die attach films on glass substrates

AU - Or, Siu Wing

AU - Wong, S.Y.

AU - Wong, H.C.

AU - Cheung, Y.M.

AU - Choy, P.K.

PY - 2008

Y1 - 2008

M3 - Conference presentation (not published in journal/proceeding/book)

SP - 319

EP - 320

T2 - Symposium on Ultrasonic Electronics

Y2 - 1 January 2008

ER -