Abstract
The plastic deformation of nanocrystalline copper subjected to tension has been studied using molecular dynamics simulation. The results show that, in the initial stage, the deformation is mainly boundary-mediated in small grains; while in the late stage, the deformation is accommodated by dislocations in large grains. It is also found that the stress-assisted grain growth occurs owing to atomic diffusion and grain boundary migration. These results are consistent with recent experimental observations.
| Original language | English |
|---|---|
| Pages (from-to) | 570-574 |
| Number of pages | 5 |
| Journal | Physics Letters, Section A: General, Atomic and Solid State Physics |
| Volume | 373 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 26 Jan 2009 |
| Externally published | Yes |
Keywords
- Dislocation
- Grain growth
- Molecular dynamics simulation
- Nanocrystalline copper
- Plastic deformation
ASJC Scopus subject areas
- General Physics and Astronomy