Roles of grain boundary and dislocations at different deformation stages of nanocrystalline copper under tension

Y. G. Zheng; H. W. Zhang; Z. Chen; C. Lu; Y. W. Mai

doi:10.1016/j.physleta.2008.12.019

Roles of grain boundary and dislocations at different deformation stages of nanocrystalline copper under tension

Y. G. Zheng, H. W. Zhang, Z. Chen, C. Lu, Y. W. Mai

Research output: Journal article publication › Journal article › Academic research › peer-review

39 Citations (Scopus)

Abstract

The plastic deformation of nanocrystalline copper subjected to tension has been studied using molecular dynamics simulation. The results show that, in the initial stage, the deformation is mainly boundary-mediated in small grains; while in the late stage, the deformation is accommodated by dislocations in large grains. It is also found that the stress-assisted grain growth occurs owing to atomic diffusion and grain boundary migration. These results are consistent with recent experimental observations.

Original language	English
Pages (from-to)	570-574
Number of pages	5
Journal	Physics Letters, Section A: General, Atomic and Solid State Physics
Volume	373
Issue number	5
DOIs	https://doi.org/10.1016/j.physleta.2008.12.019
Publication status	Published - 26 Jan 2009
Externally published	Yes

Keywords

Dislocation
Grain growth
Molecular dynamics simulation
Nanocrystalline copper
Plastic deformation

ASJC Scopus subject areas

General Physics and Astronomy

More information

10.1016/j.physleta.2008.12.019

Cite this

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Roles of grain boundary and dislocations at different deformation stages of nanocrystalline copper under tension. / Zheng, Y. G.; Zhang, H. W.; Chen, Z. et al.
In: Physics Letters, Section A: General, Atomic and Solid State Physics, Vol. 373, No. 5, 26.01.2009, p. 570-574.

Research output: Journal article publication › Journal article › Academic research › peer-review

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AU - Zheng, Y. G.

AU - Zhang, H. W.

AU - Chen, Z.

AU - Lu, C.

AU - Mai, Y. W.

PY - 2009/1/26

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AB - The plastic deformation of nanocrystalline copper subjected to tension has been studied using molecular dynamics simulation. The results show that, in the initial stage, the deformation is mainly boundary-mediated in small grains; while in the late stage, the deformation is accommodated by dislocations in large grains. It is also found that the stress-assisted grain growth occurs owing to atomic diffusion and grain boundary migration. These results are consistent with recent experimental observations.

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KW - Grain growth

KW - Molecular dynamics simulation

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Roles of grain boundary and dislocations at different deformation stages of nanocrystalline copper under tension

Abstract

Keywords

ASJC Scopus subject areas

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