RoHs & WEEE : status, compliance, issues and implications

Y.C. Chan, H.S.B. Lam, Kam Chuen Yung, P.W.L. Chau, M. Pecht, P. Beullens, D. Hammond

Research output: Authored / edited book › Research book or monograph (as author) › Academic research

Original language	English
Publisher	Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering
ISBN (Print)	9624422788
Publication status	Published - 2006

Cite this

@book{2ff3abe0b74f49eab3b8239b00c9b7c6,

title = "RoHs & WEEE : status, compliance, issues and implications",

author = "Y.C. Chan and H.S.B. Lam and Yung, {Kam Chuen} and P.W.L. Chau and M. Pecht and P. Beullens and D. Hammond",

year = "2006",

language = "English",

isbn = "9624422788",

publisher = "Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering",

}

TY - BOOK

T1 - RoHs & WEEE : status, compliance, issues and implications

AU - Chan, Y.C.

AU - Lam, H.S.B.

AU - Yung, Kam Chuen

AU - Chau, P.W.L.

AU - Pecht, M.

AU - Beullens, P.

AU - Hammond, D.

PY - 2006

Y1 - 2006

M3 - Research book or monograph (as author)

SN - 9624422788

BT - RoHs & WEEE : status, compliance, issues and implications

PB - Centre for Electronic Packaging and Assemblies, Failure Analysis and Reliability Engineering

ER -