Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

E. H. Wong, Y. W. Mai

Research output: Authored / edited bookResearch book or monograph (as author)Academic researchpeer-review

7 Citations (Scopus)

Abstract

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

Original languageEnglish
PublisherElsevier
Number of pages457
ISBN (Electronic)9781845695286
ISBN (Print)9780857099112
DOIs
Publication statusPublished - 1 Jan 2015
Externally publishedYes

ASJC Scopus subject areas

  • General Engineering

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