TY - BOOK
T1 - Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
AU - Wong, E. H.
AU - Mai, Y. W.
N1 - Publisher Copyright:
© 2015 Elsevier Ltd. All rights reserved.
PY - 2015/1/1
Y1 - 2015/1/1
N2 - Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
AB - Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
UR - http://www.scopus.com/inward/record.url?scp=85116064980&partnerID=8YFLogxK
U2 - 10.1016/C2013-0-17253-4
DO - 10.1016/C2013-0-17253-4
M3 - Research book or monograph (as author)
AN - SCOPUS:85116064980
SN - 9780857099112
BT - Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
PB - Elsevier
ER -