Abstract
In this article, we evaluated the bondability of aluminum and gold wires on multilayer FR-4 printed circuit board (PCB) with immersion silver finish by using an automatic wedge bonder equipped with ultrasonic transducers operating at conventional 62 kHz and at higher frequency of 138 kHz. Very good bondability of aluminum was obtained at both bonding frequencies. However, the bonder with transducer at higher frequency provided a larger window for setting the bond power. Its bond points exhibit a smaller deformation of the bonding wire, less heel crack and less metal splash. Tarnishing of the silver finish was observed if the boards were left in atmosphere for days. The XPS analysis revealed an additional layer of sulfur compound on the silver surface. The adverse effect of this layer made the wirebonding very difficult and proper storage of the board was important to maintain good bondability.
Original language | English |
---|---|
Title of host publication | International Symposium on Electronic Materials and Packaging, EMAP 2000 |
Publisher | IEEE |
Pages | 444-448 |
Number of pages | 5 |
ISBN (Electronic) | 0780366549, 9780780366541 |
DOIs | |
Publication status | Published - 1 Jan 2000 |
Externally published | Yes |
Event | International Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, Hong Kong Duration: 30 Nov 2000 → 2 Dec 2000 |
Conference
Conference | International Symposium on Electronic Materials and Packaging, EMAP 2000 |
---|---|
Country/Territory | Hong Kong |
City | Hong Kong |
Period | 30/11/00 → 2/12/00 |
ASJC Scopus subject areas
- General Engineering