Resist hardening by fluorocarbon plasma for electron-beam and optical mix-and-match lithography

Victor W.C. Chan; C. H. Hai; Philip Ching Ho Chan

doi:10.1116/1.1364700

Resist hardening by fluorocarbon plasma for electron-beam and optical mix-and-match lithography

Victor W.C. Chan, C. H. Hai, Philip Ching Ho Chan

Research output: Journal article publication › Conference article › Academic research › peer-review

2 Citations (Scopus)

Abstract

A resist hardening process using fluorocarbon plasma for optical mix-and-match lithography and electron-beam lithography was reported. The optical resist under low power fluorocarbon plasma was exposed using resist hardening process. It was found that optical resist profile did not change during the entire process. The matching of optical resist and e-beam was found to be excellent.

Original language	English
Pages (from-to)	743-748
Number of pages	6
Journal	Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume	19
Issue number	3
DOIs	https://doi.org/10.1116/1.1364700
Publication status	Published - 1 May 2001
Externally published	Yes
Event	13th International Vaccum Microelectronics Conference - Guangzhou, China Duration: 14 Aug 2000 → 17 Aug 2000

ASJC Scopus subject areas

Condensed Matter Physics
Electrical and Electronic Engineering

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10.1116/1.1364700

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abstract = "A resist hardening process using fluorocarbon plasma for optical mix-and-match lithography and electron-beam lithography was reported. The optical resist under low power fluorocarbon plasma was exposed using resist hardening process. It was found that optical resist profile did not change during the entire process. The matching of optical resist and e-beam was found to be excellent.",

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Resist hardening by fluorocarbon plasma for electron-beam and optical mix-and-match lithography. / Chan, Victor W.C.; Hai, C. H.; Chan, Philip Ching Ho.
In: Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, Vol. 19, No. 3, 01.05.2001, p. 743-748.

Research output: Journal article publication › Conference article › Academic research › peer-review

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AU - Chan, Victor W.C.

AU - Hai, C. H.

AU - Chan, Philip Ching Ho

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Y1 - 2001/5/1

N2 - A resist hardening process using fluorocarbon plasma for optical mix-and-match lithography and electron-beam lithography was reported. The optical resist under low power fluorocarbon plasma was exposed using resist hardening process. It was found that optical resist profile did not change during the entire process. The matching of optical resist and e-beam was found to be excellent.

AB - A resist hardening process using fluorocarbon plasma for optical mix-and-match lithography and electron-beam lithography was reported. The optical resist under low power fluorocarbon plasma was exposed using resist hardening process. It was found that optical resist profile did not change during the entire process. The matching of optical resist and e-beam was found to be excellent.

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DO - 10.1116/1.1364700

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JO - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

JF - Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

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T2 - 13th International Vaccum Microelectronics Conference

Y2 - 14 August 2000 through 17 August 2000

ER -

Resist hardening by fluorocarbon plasma for electron-beam and optical mix-and-match lithography

Abstract

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