Resist hardening by fluorocarbon plasma for electron-beam and optical mix-and-match lithography

Victor W.C. Chan, C. H. Hai, Philip Ching Ho Chan

Research output: Journal article publicationConference articleAcademic researchpeer-review

2 Citations (Scopus)

Abstract

A resist hardening process using fluorocarbon plasma for optical mix-and-match lithography and electron-beam lithography was reported. The optical resist under low power fluorocarbon plasma was exposed using resist hardening process. It was found that optical resist profile did not change during the entire process. The matching of optical resist and e-beam was found to be excellent.
Original languageEnglish
Pages (from-to)743-748
Number of pages6
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume19
Issue number3
DOIs
Publication statusPublished - 1 May 2001
Externally publishedYes
Event13th International Vaccum Microelectronics Conference - Guangzhou, China
Duration: 14 Aug 200017 Aug 2000

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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