Research on process and mechanism of micro punching driven by laser-induced cavitation

Yu Deng, Ming Xie, C. P. Tsui, Zhongning Guo, Zhiqiang Yin

Research output: Journal article publicationConference articleAcademic researchpeer-review

2 Citations (Scopus)


In this paper, a method of micro-punching driven by combining laser-induced cavitation was proposed. By analysing the surface roughness and the morphology of copper foil punched by the process, the influences of key process parameters including laser energy, cavitation position and punching times on the punching workpiece were systematically studied. With the laser focus position changing from -1 mm to +3 mm, the maximum depth of punching copper foil pits gradually decreased from 118.10μm to 55.19μm, and the ablative degree of the pit bottom reduced gradually. Meanwhile, it is found by high speed camera that the plasma shock, collapse shock and micro-jet produced by laser induced cavitation are the main driven power sources for deformation. Finally, the process is optimized with laser focus position of +2 mm, laser energy of 10.1mJ and 5 laser pulses, the surface ablation could be completely avoided.

Original languageEnglish
Pages (from-to)1010-1014
Number of pages5
JournalProcedia CIRP
Publication statusPublished - 2020
Event20th CIRP Conference on Electro Physical and Chemical Machining, ISEM 2020 - Zurich, Online, Switzerland
Duration: 19 Jan 202121 Jan 2021


  • Cavitation jet
  • Laser cavitation
  • Laser micro punch-forming
  • Laser plasma
  • Laser-induced cavitation

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering


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