TY - JOUR
T1 - Research on process and mechanism of micro punching driven by laser-induced cavitation
AU - Deng, Yu
AU - Xie, Ming
AU - Tsui, C. P.
AU - Guo, Zhongning
AU - Yin, Zhiqiang
N1 - Funding Information:
This work was supported by the National natural science foundation of China (51805092), Special fund project of Guangdong academy of sciences to build a first-class research institution in China (2019GDASYL-0103019), the Open Fund of the Key laboratory of High-Incidence-Tumour Prevention & Treatment (Guangxi Medical University) (GKE2019-KF02) and the Research Committee of The Hong Kong Polytechnic University (Project codes: 1-ZVL2 & G-YBVX).
Publisher Copyright:
© 2020 The Authors. Published by Elsevier B.V.
PY - 2020
Y1 - 2020
N2 - In this paper, a method of micro-punching driven by combining laser-induced cavitation was proposed. By analysing the surface roughness and the morphology of copper foil punched by the process, the influences of key process parameters including laser energy, cavitation position and punching times on the punching workpiece were systematically studied. With the laser focus position changing from -1 mm to +3 mm, the maximum depth of punching copper foil pits gradually decreased from 118.10μm to 55.19μm, and the ablative degree of the pit bottom reduced gradually. Meanwhile, it is found by high speed camera that the plasma shock, collapse shock and micro-jet produced by laser induced cavitation are the main driven power sources for deformation. Finally, the process is optimized with laser focus position of +2 mm, laser energy of 10.1mJ and 5 laser pulses, the surface ablation could be completely avoided.
AB - In this paper, a method of micro-punching driven by combining laser-induced cavitation was proposed. By analysing the surface roughness and the morphology of copper foil punched by the process, the influences of key process parameters including laser energy, cavitation position and punching times on the punching workpiece were systematically studied. With the laser focus position changing from -1 mm to +3 mm, the maximum depth of punching copper foil pits gradually decreased from 118.10μm to 55.19μm, and the ablative degree of the pit bottom reduced gradually. Meanwhile, it is found by high speed camera that the plasma shock, collapse shock and micro-jet produced by laser induced cavitation are the main driven power sources for deformation. Finally, the process is optimized with laser focus position of +2 mm, laser energy of 10.1mJ and 5 laser pulses, the surface ablation could be completely avoided.
KW - Cavitation jet
KW - Laser cavitation
KW - Laser micro punch-forming
KW - Laser plasma
KW - Laser-induced cavitation
UR - http://www.scopus.com/inward/record.url?scp=85102021798&partnerID=8YFLogxK
U2 - 10.1016/j.procir.2020.01.168
DO - 10.1016/j.procir.2020.01.168
M3 - Conference article
AN - SCOPUS:85102021798
SN - 2212-8271
VL - 95
SP - 1010
EP - 1014
JO - Procedia CIRP
JF - Procedia CIRP
T2 - 20th CIRP Conference on Electro Physical and Chemical Machining, ISEM 2020
Y2 - 19 January 2021 through 21 January 2021
ER -