TY - GEN
T1 - Research on parameters of bonnet polishing based on FEA
AU - Wang, Chunjin
AU - Yang, Wei
AU - Guo, Yinbiao
AU - Wang, Zhenzhong
AU - Zheng, Maojiang
N1 - Copyright:
Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2012
Y1 - 2012
N2 - In this paper, according to the bonnet polishing technology, in order to get the change regularity of the bonnet's deformation, the inflated deformation model of the bonnet, which is made all of rubber or made of rubber but with a nylon enhancement layer, is established and analyzed by using the FEA simulation. And then, by simulating the process of the bonnet polishing the plane wafer, it achieves the contact pressure curve which varies with the bonnet decrement. According to the Preston equation, k can be acquired through the experiment, v can be achieved through mathematical modeling, and p has been achieved in this paper. Thus, the removal function based on FEA will be acquired.
AB - In this paper, according to the bonnet polishing technology, in order to get the change regularity of the bonnet's deformation, the inflated deformation model of the bonnet, which is made all of rubber or made of rubber but with a nylon enhancement layer, is established and analyzed by using the FEA simulation. And then, by simulating the process of the bonnet polishing the plane wafer, it achieves the contact pressure curve which varies with the bonnet decrement. According to the Preston equation, k can be acquired through the experiment, v can be achieved through mathematical modeling, and p has been achieved in this paper. Thus, the removal function based on FEA will be acquired.
KW - Bonnet decrement
KW - Bonnet polishing
KW - Contact pressure
KW - FEA
KW - Processing parameter
UR - http://www.scopus.com/inward/record.url?scp=83255192744&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMR.403-408.486
DO - 10.4028/www.scientific.net/AMR.403-408.486
M3 - Conference article published in proceeding or book
AN - SCOPUS:83255192744
SN - 9783037853122
T3 - Advanced Materials Research
SP - 486
EP - 490
BT - MEMS, NANO and Smart Systems
T2 - 2011 7th International Conference on MEMS, NANO and Smart Systems, ICMENS 2011
Y2 - 4 November 2011 through 6 November 2011
ER -