Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener

Guo Wei Xiao, Philip Ching Ho Chan, Ricky S.W. Lee, Matthew M.F. Yuen

Research output: Journal article publicationConference articleAcademic researchpeer-review

3 Citations (Scopus)

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Keyphrases

Engineering

Material Science