Keyphrases
Reliability Evaluation
100%
Silicon CMOS
100%
Carbon Nanotube Interconnects
100%
Carbon Nanotubes
83%
Thermal Stress
33%
Electrical Properties
33%
Electromigration
33%
Dielectric
16%
Multi-walled Carbon Nanotubes (MWCNTs)
16%
Conductance
16%
High Current Density
16%
Integration Scheme
16%
Electrical Stress
16%
Conductive Materials
16%
Copper Conductor
16%
High Thermal Conductivity
16%
Joule Heating
16%
Heat Sink
16%
Outer Shell
16%
Engineering
Reliability Evaluation
100%
Interconnects
100%
Carbon Nanotubes
100%
Test Structure
25%
Thermal Stress
16%
Electromigration
16%
High Current Density
8%
Power Level
8%
High Thermal Conductivity
8%
Outer Shell
8%
Dielectrics
8%
Conductive Material
8%
Resistance Heating
8%
Material Science
Silicon
100%
Carbon Nanotubes
100%
Thermal Stress
16%
Thermal Conductivity
8%
Conductor
8%
Conductive Material
8%
Density
8%
Dielectric Material
8%
Chemical Engineering
Carbon Nanotube
100%
Thermal Conductivity
8%
Joule Heating
8%