Rate and temperature effects on crack blunting mechanisms in pure and modified epoxies

It Meng Low, Yiu Wing Mai

Research output: Journal article publicationJournal articleAcademic researchpeer-review

45 Citations (Scopus)

Abstract

The failure mechanisms of several epoxy polymers (including pure, rubber- and particulatemodified, as well as rubber/particulate hybrid epoxies) were investigated over a wide range of strain rates (10-6 to 102 sec-1) and temperatures (-80 to 60° C). A substantial variation in fracture toughness, GIc, with rate was observed at both very high and very low strain rates. Under impact testing conditions, GIc for both pure and rubber-modified epoxies displayed peaks at about 23 and -80° C which appeared to correlate with the corresponding size of the crack tip plastic zone. In order to explain these rate and temperature-dependent GIc results, two separate crack blunting mechanisms were proposed: thermal blunting due to crack tip adiabatic heating and plastic blunting associated with shear yield/flow processes. Thermal blunting was found to occur in the pure- and rubber-modified epoxies under all impact testing conditions and temperatures above 0° C. For temperatures below -20° C under impact conditions, the fracture toughness is dependent on viscoelastic loss processes and not thermal blunting. Plastic blunting was predominant at very slow strain rates less than 10-2 sec-1 for the pure- and rubber-modified epoxies and at impact strain rates for the fibre and hybrid epoxies. Microstructural studies of fracture surfaces provided some essential support for the two proposed crack blunting mechanisms.

Original languageEnglish
Pages (from-to)1634-1644
Number of pages11
JournalJournal of Materials Science
Volume24
Issue number5
DOIs
Publication statusPublished - May 1989
Externally publishedYes

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Science (miscellaneous)
  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering
  • Polymers and Plastics

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