Abstract
Modeling methods for anodic bonding process and simulation were introduced. Models were set up to simulate bonding currents and bonding process with planar cathode, single pin cathode, multi pin cathodes. Visual program on anodic bonding process was accomplished based on dynamic database and three modes. Simulation for general anodic bonding process and MEMS technical CAD are realized.
| Original language | English |
|---|---|
| Pages (from-to) | 270-271 |
| Number of pages | 2 |
| Journal | Zhongguo Jixie Gongcheng/China Mechanical Engineering |
| Volume | 16 |
| Issue number | SUPPL. |
| Publication status | Published - Jul 2005 |
| Externally published | Yes |
Keywords
- Anodic bonding
- CAD
- Process simulation
- Technology database
ASJC Scopus subject areas
- Mechanical Engineering