Process issues on peripheral to area-array bond pad redistribution

Simon P C Law, Philip Ching Ho Chan

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

Bonding pad design on a chip can be redistributed to area array using a dielectric layer. Photosensitive Benzocyclobutene (BCB), electroless Ni/Au under bump metallurgy (UBM) and laser solder ball bumper were used to realize flip chip redistribution wafer in HKUST. BCB was chosen as the inter-metal dielectric because of it has low moisture uptake, high chemical resistance and low dielectric constant. Test wafers with 100 I/Os per chip and a 500 μm pitch were realized. During the process development, we identified several process issues which may affect the manufacturing yield and the reliability of the redistributed chip. They were: the cracking of the BCB film, the pool plating on electroless Ni, the optimization of laser energy and current for producing solder joints with good shear characteristics.
Original languageEnglish
Title of host publication2002 Proceedings - 8th International Advanced Packaging Materials Symposium
PublisherIEEE
Pages25-28
Number of pages4
ISBN (Electronic)0780374347, 9780780374348
DOIs
Publication statusPublished - 1 Jan 2002
Externally publishedYes
Event8th International Advanced Packaging Materials Symposium - Stone Mountain, United States
Duration: 3 Mar 20026 Mar 2002

Conference

Conference8th International Advanced Packaging Materials Symposium
CountryUnited States
CityStone Mountain
Period3/03/026/03/02

Keywords

  • BCB
  • Electroless Ni/Au UBM
  • Flip chip
  • Redistribution
  • Solder ball bumper

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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