Process issues on peripheral to area-array bond pad redistribution

Simon P C Law; Philip Ching Ho Chan

doi:10.1109/ISAPM.2002.990361

Process issues on peripheral to area-array bond pad redistribution

Simon P C Law, Philip Ching Ho Chan

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

1 Citation (Scopus)

Abstract

Bonding pad design on a chip can be redistributed to area array using a dielectric layer. Photosensitive Benzocyclobutene (BCB), electroless Ni/Au under bump metallurgy (UBM) and laser solder ball bumper were used to realize flip chip redistribution wafer in HKUST. BCB was chosen as the inter-metal dielectric because of it has low moisture uptake, high chemical resistance and low dielectric constant. Test wafers with 100 I/Os per chip and a 500 μm pitch were realized. During the process development, we identified several process issues which may affect the manufacturing yield and the reliability of the redistributed chip. They were: the cracking of the BCB film, the pool plating on electroless Ni, the optimization of laser energy and current for producing solder joints with good shear characteristics.

Original language	English
Title of host publication	2002 Proceedings - 8th International Advanced Packaging Materials Symposium
Publisher	IEEE
Pages	25-28
Number of pages	4
ISBN (Electronic)	0780374347, 9780780374348
DOIs	https://doi.org/10.1109/ISAPM.2002.990361
Publication status	Published - 1 Jan 2002
Externally published	Yes
Event	8th International Advanced Packaging Materials Symposium - Stone Mountain, United States Duration: 3 Mar 2002 → 6 Mar 2002

Conference

Conference	8th International Advanced Packaging Materials Symposium
Country/Territory	United States
City	Stone Mountain
Period	3/03/02 → 6/03/02

Keywords

BCB
Electroless Ni/Au UBM
Flip chip
Redistribution
Solder ball bumper

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials

More information

10.1109/ISAPM.2002.990361

Cite this

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title = "Process issues on peripheral to area-array bond pad redistribution",

abstract = "Bonding pad design on a chip can be redistributed to area array using a dielectric layer. Photosensitive Benzocyclobutene (BCB), electroless Ni/Au under bump metallurgy (UBM) and laser solder ball bumper were used to realize flip chip redistribution wafer in HKUST. BCB was chosen as the inter-metal dielectric because of it has low moisture uptake, high chemical resistance and low dielectric constant. Test wafers with 100 I/Os per chip and a 500 μm pitch were realized. During the process development, we identified several process issues which may affect the manufacturing yield and the reliability of the redistributed chip. They were: the cracking of the BCB film, the pool plating on electroless Ni, the optimization of laser energy and current for producing solder joints with good shear characteristics.",

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Process issues on peripheral to area-array bond pad redistribution

Abstract

Conference

Keywords

ASJC Scopus subject areas

More information

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