Preparation and electromagnetic interference shielding effectiveness of electroless copper deposition on polyester fabric

R. H. Guo, S. Q. Jiang, C. W M Yuen, Man Ching Frankie Ng, G. H. Zheng

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

In this paper, copper was electroless deposited on polyester fabric with sodium hydrophosphite as a reducing agent and nickel as mediator. Effect of additive nickel concentration on deposition rate, composition, surface morphology, crystal structure and electromagnetic interference (EMI) shielding effectiveness of electroless copper deposits were investigated. The results showed that deposition rate increased with a higher nickel ion concentration. The copper content in these deposits decreased, whereas nickel content increased. Compact coating layers were obtained and particle size increased with an increase of copper ion in the solution. The deposited copper film exhibited a characteristic face-centered cubic crystalline structure. The EMI shielding effectiveness of the copper deposits also increased with a higher nickel ion concentration.
Original languageEnglish
Title of host publicationProceedings of the Fiber Society 2009 Spring Conference
PublisherDonghua University press
Pages1063
Number of pages1
ISBN (Print)9787506456357
Publication statusPublished - 1 Jan 2009
EventInternational Conference on Fibrous Materials 2009 - Shanghai, China
Duration: 27 May 200929 May 2009

Conference

ConferenceInternational Conference on Fibrous Materials 2009
Country/TerritoryChina
CityShanghai
Period27/05/0929/05/09

Keywords

  • Copper
  • Electroless plating
  • Electromagnetic interference shielding
  • Polyester fabric

ASJC Scopus subject areas

  • Materials Science(all)

Cite this