Abstract
In this paper, copper was electroless deposited on polyester fabric with sodium hydrophosphite as a reducing agent and nickel as mediator. Effect of additive nickel concentration on deposition rate, composition, surface morphology, crystal structure and electromagnetic interference (EMI) shielding effectiveness of electroless copper deposits were investigated. The results showed that deposition rate increased with a higher nickel ion concentration. The copper content in these deposits decreased, whereas nickel content increased. Compact coating layers were obtained and particle size increased with an increase of copper ion in the solution. The deposited copper film exhibited a characteristic face-centered cubic crystalline structure. The EMI shielding effectiveness of the copper deposits also increased with a higher nickel ion concentration.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the Fiber Society 2009 Spring Conference |
| Publisher | Donghua University press |
| Pages | 1063 |
| Number of pages | 1 |
| ISBN (Print) | 9787506456357 |
| Publication status | Published - 1 Jan 2009 |
| Event | International Conference on Fibrous Materials 2009 - Shanghai, China Duration: 27 May 2009 → 29 May 2009 |
Conference
| Conference | International Conference on Fibrous Materials 2009 |
|---|---|
| Country/Territory | China |
| City | Shanghai |
| Period | 27/05/09 → 29/05/09 |
Keywords
- Copper
- Electroless plating
- Electromagnetic interference shielding
- Polyester fabric
ASJC Scopus subject areas
- General Materials Science