Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product

C.M.K. Fung; Kam Chuen Yung

Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product

C.M.K. Fung, Kam Chuen Yung

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Publication status	Published - 2002
Event	International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing - Duration: 1 Jan 2002 → …

Conference

Conference	International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing
Period	1/01/02 → …

Cite this

@conference{749ad427805d42f9a795061d7943f8d7,

title = "Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product",

author = "C.M.K. Fung and Yung, \{Kam Chuen\}",

year = "2002",

language = "English",

note = "International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing ; Conference date: 01-01-2002",

}

Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product. / Fung, C.M.K.; Yung, Kam Chuen.
2002. Paper presented at International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

TY - CONF

T1 - Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product

AU - Fung, C.M.K.

AU - Yung, Kam Chuen

PY - 2002

Y1 - 2002

M3 - Conference presentation (not published in journal/proceeding/book)

T2 - International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing

Y2 - 1 January 2002

ER -