Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product

C.M.K. Fung; Kam Chuen Yung

Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product

C.M.K. Fung
, Kam Chuen Yung

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Publication status	Published - 2002
Event	International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing - Duration: 1 Jan 2002 → …

Conference

Conference	International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing
Period	1/01/02 → …

Cite this

@conference{749ad427805d42f9a795061d7943f8d7,

title = "Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product",

author = "C.M.K. Fung and Yung, \{Kam Chuen\}",

year = "2002",

language = "English",

note = "International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing ; Conference date: 01-01-2002",

}

Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product. / Fung, C.M.K.; Yung, Kam Chuen.
2002. Paper presented at International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

TY - CONF

T1 - Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product

AU - Fung, C.M.K.

AU - Yung, Kam Chuen

PY - 2002

Y1 - 2002

M3 - Conference presentation (not published in journal/proceeding/book)

T2 - International IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing

Y2 - 1 January 2002

ER -