Preliminary study on effect of the coating process parameters to the coating thickness of thermal cured resin in the manufacture of microvia product

C.M.K. Fung, Kam Chuen Yung

Research output: Unpublished conference presentation (presented paper, abstract, poster)Conference presentation (not published in journal/proceeding/book)Academic researchpeer-review

Original languageEnglish
Publication statusPublished - 2002
EventInternational IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing -
Duration: 1 Jan 2002 → …

Conference

ConferenceInternational IEEE Symposium on High Density Packaging and Component Failure Analysis in Electronics Manufacturing
Period1/01/02 → …

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