Abstract
A piezoelectric wafer is here embedded in a glass fibre preform that is placed in a mould for resin transfer moulding. The experiment displays that the resonant characteristics of a transfer function, in terms of the ratio between the electric voltage output from the piezoelectric wafer and the input to a electric circuit cascaded with the wafer, rely on resin injecting and curing process, and highlight the beginning/end of the resin injecting as well as the end of the exothermic reaction in composite manufacturing with the resin transfer moulding,. The relationships of the resonant response with resin flow and curing can then provide a basis of a prospective in-situ monitoring technique of the composite manufacturing. Further analysis reveals that the mechanical impedance, contributed by surroundings and associated with the resin flow, curing and exothermic induced temperature change, can be correlated with and even extracted from the transfer function amplitude at a frequency that is same as the anti-resonant frequency of the piezoelectric wafer in air. It can further provide information about the flow front position and curing state of the resin.
Original language | English |
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Pages (from-to) | 68-74 |
Number of pages | 7 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 3241 |
DOIs | |
Publication status | Published - 1997 |
Externally published | Yes |
Event | Smart Materials, Structures, and Integrated Systems - Adelaide, SA, Australia Duration: 10 Dec 1997 → 10 Dec 1997 |
Keywords
- Intelligent manufacturing
- Piezoelectric wafer
- Process monitoring
- Resin transfer moulding
- Sensors and actuators
- Smart materials
- Thermoset composites
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering