Porous materials with thin interlayers for optimal thermal insulation

H.-J. Wu, Jintu Fan, N. Du

Research output: Journal article publicationJournal articleAcademic researchpeer-review

19 Citations (Scopus)

Abstract

The combined radiative and conductive heat transfer through highly porous materials is a typical nonlinear problem in engineering thermal insulations. The complexity of the integral radiative and conductive heat transfer equations especially the nonlinearity of the heat radiation item makes it extremely difficult to obtain exact solution. A theoretical model was developed based on the combined radiative and conductive heat transfer through the highly porous materials with thin interlayers and numerically solved by using finite volume method. The effects of interlayer parameters on the total resistance of the constructions were evaluated with a view of optimal thermal insulation ability. The results indicate that the thermal resistance of the porous materials could be effectively improved by adding appropriate number of interlayers having appropriate thickness. The possibility of the micro- or nano-porous interlayers with super-light weight, super-resistance to heat radiation, and super-permeability to water vapor was also directed in highly porous materials for optimal thermal insulation in further work.
Original languageEnglish
Pages (from-to)291-300
Number of pages10
JournalInternational Journal of Nonlinear Sciences and Numerical Simulation
Volume10
Issue number3
DOIs
Publication statusPublished - 1 Jan 2009

Keywords

  • Electrospinning
  • Finite volume method
  • Heat transfer
  • Nano-porous
  • Nanofiber
  • Nonlinear
  • Permeability
  • Porous
  • Radiation
  • Thermal insulation

ASJC Scopus subject areas

  • Statistical and Nonlinear Physics
  • Computational Mechanics
  • Modelling and Simulation
  • Engineering (miscellaneous)
  • Mechanics of Materials
  • General Physics and Astronomy
  • Applied Mathematics

Fingerprint

Dive into the research topics of 'Porous materials with thin interlayers for optimal thermal insulation'. Together they form a unique fingerprint.

Cite this