Keyphrases
Active Elements
33%
Center Frequency
66%
Chemical Thinning
33%
Electromechanical Coupling Coefficient
33%
Energy Conversion Performance
33%
High-frequency Ultrasonic Transducer
33%
Hybrid Processing
33%
Low Insertion Loss
33%
Mechanical Lapping
33%
Micromachined Ultrasound Transducers
100%
On-Silicon
66%
Piezoelectric Constant
33%
PMN-PT
100%
PMN-PT Crystals
100%
Processing Methods
33%
Silicon Micromachining
33%
Silicon Substrate
100%
Single-crystalline
33%
Stainless Steel Needle
33%
Thick Film
100%
Transducer Structure
66%
Wafer
33%
Wafer Bonding
33%
Wet Chemical Method
33%
Engineering
Active Element
20%
Coupling Coefficient
20%
Db Bandwidth
20%
Energy Conversion
20%
Granulocyte
100%
Hybrid Processing
20%
Insertion Loss
20%
Micro Machining
20%
Piezoelectric
20%
Processing Method
20%
Silicon Substrate
100%
Silicon Technology
20%
Silicon Wafer
20%
Stainless Steel
20%
Transducer
100%
Ultrasonics
100%
Wafer Bonding
20%