In this work, a novel high-frequency ultrasonic structure is realized by using PMNPT-on-silicon and silicon micromachining. To prepare the single PMNPT-on-silicon wafers, a hybrid processing involving wafer bonding, mechanical lapping and wet thinning is successfully developed. The active element is within the stainless steel needle housing. The measured frequency and -6 dB bandwidth of the transducer are 35 and 34%, respectively. Owing to the excellent property of PMNPT film, the transducer good energy conversion performance with a very low loss down to 8.3 dB at the center frequency.
|Number of pages||3|
|Journal||Proceedings - IEEE Ultrasonics Symposium|
|Publication status||Published - 1 Dec 2008|
|Event||2008 IEEE International Ultrasonics Symposium, IUS 2008 - Beijing, China|
Duration: 2 Nov 2008 → 5 Nov 2008
ASJC Scopus subject areas
- Acoustics and Ultrasonics