Abstract
In this work, a novel high-frequency ultrasonic structure is realized by using PMNPT-on-silicon and silicon micromachining. To prepare the single PMNPT-on-silicon wafers, a hybrid processing involving wafer bonding, mechanical lapping and wet thinning is successfully developed. The active element is within the stainless steel needle housing. The measured frequency and -6 dB bandwidth of the transducer are 35 and 34%, respectively. Owing to the excellent property of PMNPT film, the transducer good energy conversion performance with a very low loss down to 8.3 dB at the center frequency.
Original language | English |
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Article number | 4803311 |
Pages (from-to) | 161-163 |
Number of pages | 3 |
Journal | Proceedings - IEEE Ultrasonics Symposium |
DOIs | |
Publication status | Published - 1 Dec 2008 |
Event | 2008 IEEE International Ultrasonics Symposium, IUS 2008 - Beijing, China Duration: 2 Nov 2008 → 5 Nov 2008 |
ASJC Scopus subject areas
- Acoustics and Ultrasonics