PMN-PT single crystal thick films on silicon substrate for high-frequency micromachined ultrasonic transducers

J. Peng, S. T. Lau, C. Chao, Jiyan Dai, H. L.W. Chan, H. S. Luo, B. P. Zhu, Q. F. Zhou, K. K. Shung

Research output: Journal article publicationJournal articleAcademic researchpeer-review

13 Citations (Scopus)

Abstract

In this work, a novel high-frequency ultrasonic transducer structure is realized by using PMNPT-on-silicon technology and silicon micromachining. To prepare the single crystalline PMNPT-on-silicon wafers, a hybrid processing method involving wafer bonding, mechanical lapping and wet chemical thinning is successfully developed. In the transducer structure, the active element is fixed within the stainless steel needle housing. The measured center frequency and -6 dB bandwidth of the transducer are 35 MHz and 34%, respectively. Owing to the superior electromechanical coupling coefficient (kt) and high piezoelectric constant (d33) of PMNPT film, the transducer shows a good energy conversion performance with a very low insertion loss down to 8.3 dB at the center frequency.
Original languageEnglish
Pages (from-to)233-237
Number of pages5
JournalApplied Physics A: Materials Science and Processing
Volume98
Issue number1
DOIs
Publication statusPublished - 1 Jan 2010

ASJC Scopus subject areas

  • Chemistry(all)
  • Materials Science(all)

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