Piezocomposite ultrasonic transducers for microelectronic wire bonding application

Siu Wing Or; H.L.W. Chan; P.C.K. Liu

Piezocomposite ultrasonic transducers for microelectronic wire bonding application

Siu Wing Or, H.L.W. Chan, P.C.K. Liu

The Hong Kong Polytechnic University

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Pages	531-538
Number of pages	8
Publication status	Published - 2004
Event	International Workshop on Advanced Smart Materials and Smart Structures Technology - Duration: 1 Jan 2004 → …

Conference

Conference	International Workshop on Advanced Smart Materials and Smart Structures Technology
Period	1/01/04 → …

Cite this

@conference{b919fb50bad64eb6a5fc207c59d4a4c3,

title = "Piezocomposite ultrasonic transducers for microelectronic wire bonding application",

author = "Or, {Siu Wing} and H.L.W. Chan and P.C.K. Liu",

year = "2004",

language = "English",

pages = "531--538",

note = "International Workshop on Advanced Smart Materials and Smart Structures Technology ; Conference date: 01-01-2004",

}

Piezocomposite ultrasonic transducers for microelectronic wire bonding application. / Or, Siu Wing; Chan, H.L.W.; Liu, P.C.K.
2004. 531-538 Paper presented at International Workshop on Advanced Smart Materials and Smart Structures Technology.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

TY - CONF

T1 - Piezocomposite ultrasonic transducers for microelectronic wire bonding application

AU - Or, Siu Wing

AU - Chan, H.L.W.

AU - Liu, P.C.K.

PY - 2004

Y1 - 2004

M3 - Conference presentation (not published in journal/proceeding/book)

SP - 531

EP - 538

T2 - International Workshop on Advanced Smart Materials and Smart Structures Technology

Y2 - 1 January 2004

ER -