Abstract
Piezocomposite ultasonic transducers for high-frequency microelectronics wire bonding have been developed to alleviate the intrinsic mode coupling and high mechanical quality factor (Qm) in piezoceramic transducers. In this paper, a 136 kHz transducer fabricated using lead zirconate titanate (PZT)/epoxy 1-3 piezocomposite rings with 77 μm epoxy width and 0.89 PZT volume fraction is presented, together with a PZT piezoceramic transducer of similar structure. With the guide of a finite-element modal analysis, the nature of most experimental resonance modes in the transducers is identified. The low lateral coupling of the composite rings effectively suppresses the non-axial and many other spurious resonances in the composite transducer, retaining only the axial-mode resonances. Due to the effect of epoxy damping, the composite transducer exhibits a 2.4-times reduction in Qmto a desired low value of 296. This transducer has good potential to be used in commercial wire bonders for enabling high-frequency wire-bonding technology.
| Original language | English |
|---|---|
| Pages (from-to) | 195-199 |
| Number of pages | 5 |
| Journal | Sensors and Actuators, A: Physical |
| Volume | 133 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 8 Jan 2007 |
Keywords
- Finite-element analysis
- Mechanical quality factor
- Microelectronics devices
- Mode coupling
- Piezocomposites
- Ultrasonic transducers
- Ultrasonic wire bonding
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Mechanical Engineering
- Instrumentation