Piezocomposite ultrasonic transducer for high-frequency wire-bonding of microelectronics devices

Siu Wing Or, Helen Lai Wa Chan, Peter Chou Kee Liu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

27 Citations (Scopus)

Abstract

Piezocomposite ultasonic transducers for high-frequency microelectronics wire bonding have been developed to alleviate the intrinsic mode coupling and high mechanical quality factor (Qm) in piezoceramic transducers. In this paper, a 136 kHz transducer fabricated using lead zirconate titanate (PZT)/epoxy 1-3 piezocomposite rings with 77 μm epoxy width and 0.89 PZT volume fraction is presented, together with a PZT piezoceramic transducer of similar structure. With the guide of a finite-element modal analysis, the nature of most experimental resonance modes in the transducers is identified. The low lateral coupling of the composite rings effectively suppresses the non-axial and many other spurious resonances in the composite transducer, retaining only the axial-mode resonances. Due to the effect of epoxy damping, the composite transducer exhibits a 2.4-times reduction in Qmto a desired low value of 296. This transducer has good potential to be used in commercial wire bonders for enabling high-frequency wire-bonding technology.
Original languageEnglish
Pages (from-to)195-199
Number of pages5
JournalSensors and Actuators, A: Physical
Volume133
Issue number1
DOIs
Publication statusPublished - 8 Jan 2007

Keywords

  • Finite-element analysis
  • Mechanical quality factor
  • Microelectronics devices
  • Mode coupling
  • Piezocomposites
  • Ultrasonic transducers
  • Ultrasonic wire bonding

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Instrumentation

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