Piezocomposite transducer for ultrasonic wire bonding in microelectronic packaging

Siu Wing Or, H. L W Chan, Y. M. Cheung

Research output: Journal article publicationConference articleAcademic researchpeer-review

1 Citation (Scopus)

Abstract

Ultrasonic transducer for high frequency (136 kHz) wire bonding in microelectronic packaging has been developed using PZT/epoxy 1-3 composite rings with 77 μm epoxy width and 0.89 volume fraction of PZT. A PZT transducer of similar structure has also been fabricated. The performance of both transducers has been evaluated by measuring their electrical and vibrational characteristics. With the guide of a finite element modal analysis, the nature of most experimental resonance modes is readily identified. Due to the low mode coupling behavior, the non-axial and many other spurious resonances in the composite transducer are suppressed, retaining only the axial mode resonances. The mechanical quality factor of the composite transducer is 2.4 times smaller because of damping in the epoxy matrix. The problem of bonding instability caused by mode coupling and narrow bandwidth in conventional PZT transducers is alleviated, thereby enabling even fine-pitch bonding technology (< 50 μm).
Original languageEnglish
Pages (from-to)579-584
Number of pages6
JournalCeramic Engineering and Science Proceedings
Volume22
Issue number4
Publication statusPublished - 1 Dec 2001
Event25th Annual Conference on Composites, Advanced Ceramics, Materials and Structures: B - Cocoa Beach, FL, United States
Duration: 21 Jan 200127 Jan 2001

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry

Cite this