TY - GEN
T1 - Photonic thermocouple design based on an ultra-compact michelson interferometer
AU - Tao, J. F.
AU - Cai, H.
AU - Zhang, Q. X.
AU - Tsai, J. M.
AU - Kropelnicki, P.
AU - Randles, A. B.
AU - Tang, M.
AU - Liu, A. Q.
PY - 2013/6
Y1 - 2013/6
N2 - This paper reports a photonic thermocouple based on an ultra-compact Michelson Interferometer (MI) for on-chip temperature sensing. All components are fabricated by using standard CMOS process. Compared with the traditional temperature sensors based on electronics, this proposed photonics thermocouple has more compact size (40 μm × 70 μm), high sensitivity (113.72 pm/K), cost-effective, and immunity to the electromagnetic interference. The proposed photonic thermocouple has potential applications in harsh environments, such as nuclear power plants and oil-drills.
AB - This paper reports a photonic thermocouple based on an ultra-compact Michelson Interferometer (MI) for on-chip temperature sensing. All components are fabricated by using standard CMOS process. Compared with the traditional temperature sensors based on electronics, this proposed photonics thermocouple has more compact size (40 μm × 70 μm), high sensitivity (113.72 pm/K), cost-effective, and immunity to the electromagnetic interference. The proposed photonic thermocouple has potential applications in harsh environments, such as nuclear power plants and oil-drills.
KW - integrated optics sensor
KW - NEMS
KW - on-chip temperature sensing
KW - Photonic thermocouple
UR - http://www.scopus.com/inward/record.url?scp=84891669808&partnerID=8YFLogxK
U2 - 10.1109/Transducers.2013.6627281
DO - 10.1109/Transducers.2013.6627281
M3 - Conference article published in proceeding or book
AN - SCOPUS:84891669808
SN - 9781467359818
T3 - 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
SP - 2365
EP - 2368
BT - 2013 Transducers and Eurosensors XXVII
T2 - 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Y2 - 16 June 2013 through 20 June 2013
ER -