Photonic thermocouple design based on an ultra-compact michelson interferometer

J. F. Tao, H. Cai, Q. X. Zhang, J. M. Tsai, P. Kropelnicki, A. B. Randles, M. Tang, A. Q. Liu

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

This paper reports a photonic thermocouple based on an ultra-compact Michelson Interferometer (MI) for on-chip temperature sensing. All components are fabricated by using standard CMOS process. Compared with the traditional temperature sensors based on electronics, this proposed photonics thermocouple has more compact size (40 μm × 70 μm), high sensitivity (113.72 pm/K), cost-effective, and immunity to the electromagnetic interference. The proposed photonic thermocouple has potential applications in harsh environments, such as nuclear power plants and oil-drills.

Original languageEnglish
Title of host publication2013 Transducers and Eurosensors XXVII
Subtitle of host publicationThe 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages2365-2368
Number of pages4
DOIs
Publication statusPublished - Jun 2013
Externally publishedYes
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
Duration: 16 Jun 201320 Jun 2013

Publication series

Name2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Conference

Conference2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Country/TerritorySpain
CityBarcelona
Period16/06/1320/06/13

Keywords

  • integrated optics sensor
  • NEMS
  • on-chip temperature sensing
  • Photonic thermocouple

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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