TY - GEN
T1 - Photonic micromachined tunable lasers
AU - Liu, A. Q.
PY - 2010/5
Y1 - 2010/5
N2 - This paper covers design, fabrication, packaging and experiments of photonic Microelectromechanical Systems (MEMS) tunable laser sources. Two different types of MEMS tunable lasers, which are MEMS coupled-cavity lasers and dual-wavelength tunable lasers, are demonstrated as examples of natural synergy of MEMS with photonics. The expansion and penetration of the MEMS technology to silicon nano-photonics creates on-chip optical systems at an unprecedented scale of integration. While producing better integration, robustness and compactness, MEMS improves the functionalities and specifications of laser devices. Additionally, MEMS photonic tunable lasers are able to deliver their merits of small size, fast tuning speed, wide tuning range and CMOS compatible integration which broaden their applications to many fields.
AB - This paper covers design, fabrication, packaging and experiments of photonic Microelectromechanical Systems (MEMS) tunable laser sources. Two different types of MEMS tunable lasers, which are MEMS coupled-cavity lasers and dual-wavelength tunable lasers, are demonstrated as examples of natural synergy of MEMS with photonics. The expansion and penetration of the MEMS technology to silicon nano-photonics creates on-chip optical systems at an unprecedented scale of integration. While producing better integration, robustness and compactness, MEMS improves the functionalities and specifications of laser devices. Additionally, MEMS photonic tunable lasers are able to deliver their merits of small size, fast tuning speed, wide tuning range and CMOS compatible integration which broaden their applications to many fields.
KW - MEMS
KW - Photonics
KW - Tunable laser
UR - http://www.scopus.com/inward/record.url?scp=77957833416&partnerID=8YFLogxK
M3 - Conference article published in proceeding or book
AN - SCOPUS:77957833416
SN - 9782355000119
T3 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
SP - 111
EP - 113
BT - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
T2 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
Y2 - 5 May 2010 through 7 May 2010
ER -