Performance study of an ultrasonic transducer used for wire bonding

S. W. Or, H. L.W. Chan, V. C. Lo, C. W. Yuen

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreements between the computed and experimental results were obtained. The desirable second axial mode was found and proven to be the dominant mode of the transduces that facilitates the bonding process. Characteristics of the transducer under different input power were also studied. Results show that its performance is good and high quality bonds can be formed.

Original languageEnglish
Title of host publicationProceedings - 1998 IEEE Hong Kong Electron Devices Meeting, HKEDM 1998
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages161-164
Number of pages4
ISBN (Electronic)0780349326, 9780780349322
DOIs
Publication statusPublished - 29 Aug 1998
Event5th IEEE Hong Kong Electron Devices Meeting, HKEDM 1998 - Hong Kong, Hong Kong
Duration: 29 Aug 199829 Aug 1998

Publication series

NameProceedings - 1998 IEEE Hong Kong Electron Devices Meeting, HKEDM 1998
Volume1998-August

Conference

Conference5th IEEE Hong Kong Electron Devices Meeting, HKEDM 1998
CountryHong Kong
CityHong Kong
Period29/08/9829/08/98

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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