Performance study of an ultrasonic transducer used for wire bonding

Siu Wing Or; H.L.W. Chan; V.C. Lo; C.W. Yuen

Performance study of an ultrasonic transducer used for wire bonding

Siu Wing Or, H.L.W. Chan, V.C. Lo, C.W. Yuen

The Hong Kong Polytechnic University

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research

Abstract

In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreements between the computed and experimental results were obtained. The desirable second axial mode was found and proven to be the dominant mode of the transducer that facilitates the bonding process. Characteristics of the transducer under different input power were also studied. Results show that its performance is good and high quality bonds can be formed.

Original language	English
Title of host publication	1998 IEEE Hong Kong Electron Devices Meeting : 29 August 1998, Hong Kong University of Science and Technology : proceedings
Publisher	IEEE
ISBN (Print)	0780349326
Publication status	Published - 1998

Keywords

Ultrasonic transducer
Wire bonding
Piezoelectric transducers
Bonding
Finite element method

Cite this

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title = "Performance study of an ultrasonic transducer used for wire bonding",

abstract = "In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreements between the computed and experimental results were obtained. The desirable second axial mode was found and proven to be the dominant mode of the transducer that facilitates the bonding process. Characteristics of the transducer under different input power were also studied. Results show that its performance is good and high quality bonds can be formed.",

keywords = "Ultrasonic transducer, Wire bonding, Piezoelectric transducers, Bonding, Finite element method",

author = "Or, {Siu Wing} and H.L.W. Chan and V.C. Lo and C.W. Yuen",

year = "1998",

language = "English",

isbn = "0780349326",

booktitle = "1998 IEEE Hong Kong Electron Devices Meeting : 29 August 1998, Hong Kong University of Science and Technology : proceedings",

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Performance study of an ultrasonic transducer used for wire bonding. / Or, Siu Wing; Chan, H.L.W.; Lo, V.C. et al.
1998 IEEE Hong Kong Electron Devices Meeting : 29 August 1998, Hong Kong University of Science and Technology : proceedings. IEEE, 1998.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research

TY - GEN

T1 - Performance study of an ultrasonic transducer used for wire bonding

AU - Or, Siu Wing

AU - Chan, H.L.W.

AU - Lo, V.C.

AU - Yuen, C.W.

PY - 1998

Y1 - 1998

N2 - In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreements between the computed and experimental results were obtained. The desirable second axial mode was found and proven to be the dominant mode of the transducer that facilitates the bonding process. Characteristics of the transducer under different input power were also studied. Results show that its performance is good and high quality bonds can be formed.

AB - In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreements between the computed and experimental results were obtained. The desirable second axial mode was found and proven to be the dominant mode of the transducer that facilitates the bonding process. Characteristics of the transducer under different input power were also studied. Results show that its performance is good and high quality bonds can be formed.

KW - Ultrasonic transducer

KW - Wire bonding

KW - Piezoelectric transducers

KW - Bonding

KW - Finite element method

M3 - Conference article published in proceeding or book

SN - 0780349326

BT - 1998 IEEE Hong Kong Electron Devices Meeting : 29 August 1998, Hong Kong University of Science and Technology : proceedings

PB - IEEE

ER -

Performance study of an ultrasonic transducer used for wire bonding

Abstract

Keywords

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