Performance study of an ultrasonic transducer used for wire bonding

Siu Wing Or, H.L.W. Chan, V.C. Lo, C.W. Yuen

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic research

Abstract

In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are presented and discussed in this paper in order to optimize the bonding process. The resonant frequencies and vibration mode shapes of the transducer were computed using finite element method (FEM) and were compared with the experimental resonant frequencies and displacement distributions. Good agreements between the computed and experimental results were obtained. The desirable second axial mode was found and proven to be the dominant mode of the transducer that facilitates the bonding process. Characteristics of the transducer under different input power were also studied. Results show that its performance is good and high quality bonds can be formed.
Original languageEnglish
Title of host publication1998 IEEE Hong Kong Electron Devices Meeting : 29 August 1998, Hong Kong University of Science and Technology : proceedings
PublisherIEEE
ISBN (Print)0780349326
Publication statusPublished - 1998

Keywords

  • Ultrasonic transducer
  • Wire bonding
  • Piezoelectric transducers
  • Bonding
  • Finite element method

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