Palm-print classification by global features

Bob Zhang, Wei Li, Pei Qing, Dapeng Zhang

Research output: Journal article publicationJournal articleAcademic researchpeer-review

36 Citations (Scopus)


Three-dimensional (3-D) palm print has proved to be a significant biometrics for personal authentication. Three-dimensional palm prints are harder to counterfeit than 2-D palm prints and more robust to variations in illumination and serious scrabbling on the palm surface. Previous work on 3-D palm-print recognition has concentrated on local features such as texture and lines. In this paper, we propose three novel global features of 3-D palm prints which describe shape information and can be used for coarse matching and indexing to improve the efficiency of palm-print recognition, particularly in very large databases. The three proposed shape features are maximum depth of palm center, horizontal cross-sectional area of different levels, and radial line length from the centroid to the boundary of 3-D palm-print horizontal cross section of different levels. We treat these features as a column vector and use orthogonal linear discriminant analysis to reduce their dimensionality. We then adopt two schemes: 1) coarse-level matching and 2) ranking support vector machine to improve the efficiency of palm-print recognition. We conducted a series of 3-D palm-print recognition experiments using an established 3-D palm-print database, and the results demonstrate that the proposed method can greatly reduce penetration rates.
Original languageEnglish
Pages (from-to)370-378
Number of pages9
JournalIEEE Transactions on Systems, Man, and Cybernetics Part A:Systems and Humans
Issue number2
Publication statusPublished - 11 Nov 2013


  • 3-D palm-print identification
  • Global features
  • Orthogonal linear discriminant analysis (LDA) (OLDA)
  • Palm-print indexing
  • Ranking support vector machine (SVM) (RSVM)

ASJC Scopus subject areas

  • Software
  • Control and Systems Engineering
  • Human-Computer Interaction
  • Computer Science Applications
  • Electrical and Electronic Engineering


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