Abstract
Three types of solder bumping processes are studied and optimized including electroplating, stencil printing and solder ball placement. In comparison with the sputtering UBM deposition process, the zincation process in the electroless Ni/Au process is very sensitive for the Al pad preparation process. The properties and effect of electroplated Cu stud and the electroless plated Ni stud are studied. Five kinds of photoresist materials are evaluated for the electroplating bumping process. In the solder bump placement process, the optimum laser power is controlled at the current range of 23 to 26mA with the exposure time of 8 to 10ms. According to the bumping sequences, the effect of every step on the quality and reliability of solder bumps are analyzed to improve the bumping process.
Original language | English |
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Pages (from-to) | 1850-1855 |
Number of pages | 6 |
Journal | Proceedings - Electronic Components and Technology Conference |
Publication status | Published - 17 Jul 2003 |
Externally published | Yes |
Event | 53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States Duration: 27 May 2003 → 30 May 2003 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering