Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

Guo Wei Xiao, Jing Feng Gong, Esther W.C. Yau, Philip Ching Ho Chan, Ricky S.W. Lee, Matthew M.F. Yuen

Research output: Journal article publicationConference articleAcademic researchpeer-review

7 Citations (Scopus)

Abstract

Three types of solder bumping processes are studied and optimized including electroplating, stencil printing and solder ball placement. In comparison with the sputtering UBM deposition process, the zincation process in the electroless Ni/Au process is very sensitive for the Al pad preparation process. The properties and effect of electroplated Cu stud and the electroless plated Ni stud are studied. Five kinds of photoresist materials are evaluated for the electroplating bumping process. In the solder bump placement process, the optimum laser power is controlled at the current range of 23 to 26mA with the exposure time of 8 to 10ms. According to the bumping sequences, the effect of every step on the quality and reliability of solder bumps are analyzed to improve the bumping process.
Original languageEnglish
Pages (from-to)1850-1855
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 17 Jul 2003
Externally publishedYes
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: 27 May 200330 May 2003

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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