Abstract
This paper investigates the dependence of surface undulation on a film thickness considerably greater than the critical value of a thin film system. It considers that surface tension and residual stress are the main cause of surface undulation. The study found that there is a critical undulation wavelength that minimizes the free energy of a thin film system, that this critical wavelength depends on the film thickness, and the effect of undulation amplitude is insignificant. The research also found that the surface undulation has a negligible influence on the residual stresses in the thin film system.
| Original language | English |
|---|---|
| Pages (from-to) | 500-504 |
| Number of pages | 5 |
| Journal | Journal of Physics and Chemistry of Solids |
| Volume | 75 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 1 Apr 2014 |
| Externally published | Yes |
Keywords
- A. Thin film
- B. Epitaxial growth
- D. Surface properties
ASJC Scopus subject areas
- Condensed Matter Physics
- General Chemistry
- General Materials Science