On the dependence of surface undulation on film thickness

Alireza Moridi, Haihui Ruan, Liangchi Zhang, Mei Liu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

1 Citation (Scopus)

Abstract

This paper investigates the dependence of surface undulation on a film thickness considerably greater than the critical value of a thin film system. It considers that surface tension and residual stress are the main cause of surface undulation. The study found that there is a critical undulation wavelength that minimizes the free energy of a thin film system, that this critical wavelength depends on the film thickness, and the effect of undulation amplitude is insignificant. The research also found that the surface undulation has a negligible influence on the residual stresses in the thin film system.
Original languageEnglish
Pages (from-to)500-504
Number of pages5
JournalJournal of Physics and Chemistry of Solids
Volume75
Issue number4
DOIs
Publication statusPublished - 1 Apr 2014
Externally publishedYes

Keywords

  • A. Thin film
  • B. Epitaxial growth
  • D. Surface properties

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Chemistry(all)
  • Materials Science(all)

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