TY - GEN
T1 - On the Consensus Mechanisms of Blockchain/DLT for Internet of Things
AU - He, Qingqiang
AU - Guan, Nan
AU - Lv, Mingsong
AU - Yi, Wang
PY - 2018/8/20
Y1 - 2018/8/20
N2 - Internet of Things (IoT) has been experiencing exponential growth in recent years, but still faces many serious challenges. The distributed ledger technology (DLT), e.g., Blockchain, not only appears to be promising to address these technical challenges, but also brings tremendous opportunities for new application and business models. However, the convergence of IoT and DLT is yet a goal far beyond our reach today. Among many problems that have not been sufficiently understood, a fundamental one is how to design appropriate consensus mechanisms for DLT applied to IoT, which is the theme of this paper. We first discuss the potential benefits of applying DLT to IoT, and identify major challenges posed to DLT by IoT. Then we make a survey of existing DLT consensus mechanisms, to summarize major principles and discuss their pros and cons when applied in IoT.
AB - Internet of Things (IoT) has been experiencing exponential growth in recent years, but still faces many serious challenges. The distributed ledger technology (DLT), e.g., Blockchain, not only appears to be promising to address these technical challenges, but also brings tremendous opportunities for new application and business models. However, the convergence of IoT and DLT is yet a goal far beyond our reach today. Among many problems that have not been sufficiently understood, a fundamental one is how to design appropriate consensus mechanisms for DLT applied to IoT, which is the theme of this paper. We first discuss the potential benefits of applying DLT to IoT, and identify major challenges posed to DLT by IoT. Then we make a survey of existing DLT consensus mechanisms, to summarize major principles and discuss their pros and cons when applied in IoT.
KW - Blockchain
KW - Consensus Mechanism
KW - Distributed Ledger Technology (DLT)
KW - Internet of Things
UR - http://www.scopus.com/inward/record.url?scp=85053452010&partnerID=8YFLogxK
U2 - 10.1109/SIES.2018.8442076
DO - 10.1109/SIES.2018.8442076
M3 - Conference article published in proceeding or book
AN - SCOPUS:85053452010
SN - 9781538641552
T3 - 2018 IEEE 13th International Symposium on Industrial Embedded Systems, SIES 2018 - Proceedings
BT - 2018 IEEE 13th International Symposium on Industrial Embedded Systems, SIES 2018 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 13th IEEE International Symposium on Industrial Embedded Systems, SIES 2018
Y2 - 6 June 2018 through 8 June 2018
ER -