This paper reports numerical simulations to analyze the thermal characteristics of three-layer wall with micro-encapsulated PCM based on the theoretical model of heat and moisture transfer in porous materials. The thermal characteristics of the wall system with different boundary conditions are analyzed by the computer simulation. The results show that the wall with encapsulated PCM can delay the temperature rise when the environmental temperature increases. The computational simulations are useful tool for designing building materials that can save energy in heating and air conditioning.
|Name||Studies in Computational Intelligence|