Numerical simulation of heat and moisture transfer in porous walls with microencapsulated PCM

Y. Li, X. Wang, S. Li, Jianlei Niu

Research output: Chapter in book / Conference proceedingChapter in an edited book (as author)Academic researchpeer-review

1 Citation (Scopus)

Abstract

This paper reports numerical simulations to analyze the thermal characteristics of three-layer wall with micro-encapsulated PCM based on the theoretical model of heat and moisture transfer in porous materials. The thermal characteristics of the wall system with different boundary conditions are analyzed by the computer simulation. The results show that the wall with encapsulated PCM can delay the temperature rise when the environmental temperature increases. The computational simulations are useful tool for designing building materials that can save energy in heating and air conditioning.
Original languageEnglish
Title of host publicationComputational Textile
Pages255-263
Number of pages9
DOIs
Publication statusPublished - 16 May 2007

Publication series

NameStudies in Computational Intelligence
Volume55
ISSN (Print)1860-949X

ASJC Scopus subject areas

  • Artificial Intelligence

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