TY - CHAP
T1 - Numerical simulation of heat and moisture transfer in porous walls with microencapsulated PCM
AU - Li, Y.
AU - Wang, X.
AU - Li, S.
AU - Niu, Jianlei
PY - 2007/5/16
Y1 - 2007/5/16
N2 - This paper reports numerical simulations to analyze the thermal characteristics of three-layer wall with micro-encapsulated PCM based on the theoretical model of heat and moisture transfer in porous materials. The thermal characteristics of the wall system with different boundary conditions are analyzed by the computer simulation. The results show that the wall with encapsulated PCM can delay the temperature rise when the environmental temperature increases. The computational simulations are useful tool for designing building materials that can save energy in heating and air conditioning.
AB - This paper reports numerical simulations to analyze the thermal characteristics of three-layer wall with micro-encapsulated PCM based on the theoretical model of heat and moisture transfer in porous materials. The thermal characteristics of the wall system with different boundary conditions are analyzed by the computer simulation. The results show that the wall with encapsulated PCM can delay the temperature rise when the environmental temperature increases. The computational simulations are useful tool for designing building materials that can save energy in heating and air conditioning.
UR - http://www.scopus.com/inward/record.url?scp=34248401915&partnerID=8YFLogxK
U2 - 10.1007/978-3-540-70658-8_16
DO - 10.1007/978-3-540-70658-8_16
M3 - Chapter in an edited book (as author)
SN - 3540706569
SN - 9783540706564
T3 - Studies in Computational Intelligence
SP - 255
EP - 263
BT - Computational Textile
ER -