Numerical investigation on stable crack growth in plane stress

Cheng Yan, Yiu Wing Mai

Research output: Journal article publicationJournal articleAcademic researchpeer-review

10 Citations (Scopus)

Abstract

Large deformation finite element analysis has been carried out to investigate the stress-strain fields ahead of a growing crack for compact tension (a/W = 0.5) and three-point bend (a/W = 0.1 and 0.5) specimens under plane stress condition. The crack growth is controlled by the experimental J-integral resistance curves measured by Sun et al. The results indicate that the distributions of opening stress, equivalent stress and equivalent strain ahead of a growing crack are not sensitive to specimen geometry. For both stationary and growing cracks, similar distributions of opening stress and triaxiality can be found along the ligament. During stable crack growth, the crack-tip opening displacement (CTOD) resistance curve and the cohesive fracture energy in the fracture process zone are independent of specimen geometry and may be suitable criteria for characterizing stable crack growth in plane stress.

Original languageEnglish
Pages (from-to)117-130
Number of pages14
JournalInternational Journal of Fracture
Volume91
Issue number2
DOIs
Publication statusPublished - 1998
Externally publishedYes

Keywords

  • Cohesive fracture energy
  • CTOD-curve
  • Plane stress
  • Specimen geometry
  • Stable crack growth

ASJC Scopus subject areas

  • Computational Mechanics
  • Modelling and Simulation
  • Mechanics of Materials

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