Numerical investigation of magnetic resonant coupling technique in inter-chip communication via electromagnetics-TCAD coupled simulation

Quan Chen, Siu Lau Ho, Weinong Fu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

2 Citations (Scopus)


Wireless power transfer based on magnetic resonant coupling (MRC) has attracted extensive studies for its applications in macroscopic engineering. In this work, we explore one potential application of MRC in microelectronics, i.e., as an enhancement of inductive coupling for wireless inter-chip communication. Theoretical analysis and numerical simulation are conducted to study the advantages of MRC in power transfer efficiency. In particular, a new EM-semiconductor simulator is employed to provide a faithful description for the interactions between magnetic fields and semiconductor carrier transport.
Original languageEnglish
Article number6332659
Pages (from-to)4253-4256
Number of pages4
JournalIEEE Transactions on Magnetics
Issue number11
Publication statusPublished - 1 Jan 2012


  • EM-TCAD simulation
  • inductive inter-chip communication
  • magnetic resonant coupling

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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