Noncontacting measurement of opaque thin films using a dual beam thermal wave probe

M. B. Suddendorf; M. Liu; Michael Geoffrey Somekh

doi:10.1063/1.109091

Noncontacting measurement of opaque thin films using a dual beam thermal wave probe

M. B. Suddendorf, M. Liu, Michael Geoffrey Somekh

Research output: Journal article publication › Journal article › Academic research › peer-review

9 Citations (Scopus)

Abstract

A dual beam thermal wave probe has been used to measure the thickness of opaque thin films in a noncontact, nondestructive manner. The method relies on the measurement of the differential phase of two interferometrically determined photodisplacement signals. The technique does not require calibration against standard samples and can be used to determine film thicknesses from a few tens of nanometers up to several micrometers. Alternatively, if the film thickness is known, thermal material properties like diffusivity or conductivity can be determined. The conditions under which the system is expected to give the most accurate results are analyzed.

Original language	English
Pages (from-to)	3256-3258
Number of pages	3
Journal	Applied Physics Letters
Volume	62
Issue number	25
DOIs	https://doi.org/10.1063/1.109091
Publication status	Published - 1 Dec 1993
Externally published	Yes

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.109091

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Noncontacting measurement of opaque thin films using a dual beam thermal wave probe

Abstract

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